XG50 Solder paste

Overview

XG50 Solder Paste (50g, Lead-Free)
Description: Achieve flawless soldering results with XG50 Solder Paste. This high-quality lead-free solder paste is designed for precision soldering in electronic assembly and repair work. With its superior flux composition and fine solder powder, XG50 ensures excellent wetting and strong, reliable solder joints. Perfect for use with both manual and automated soldering techniques.

Features:

Lead-Free Composition: Compliant with RoHS standards, ideal for lead-free soldering applications.
High-Quality Flux: Provides excellent flux activity for improved wetting and reduced soldering defects.
Fine Solder Powder: Ensures precise control and consistent solder joints.
Smooth Application: Easy to apply with a syringe or stencil, suitable for various soldering techniques.
Wide Temperature Range: Suitable for reflow soldering with a broad range of temperature profiles.
Long Shelf Life: Stable formulation with a long shelf life for reliable performance.
Specifications:

Type: Lead-Free Solder Paste
Package Size: 50g
Flux Content: 15-25% (by weight)
Solder Powder Size: paste is generally composed of fine solder powder for precise applications.
Melting Point: Approximately 217°C (average melting point of lead-free solder)
Storage Temperature: Store at room temperature, avoid exposure to moisture and high temperatures.
Applications:

SMT (Surface-Mount Technology) assembly
PCB (Printed Circuit Board) repairs and rework
DIY electronics projects
Automated soldering systems
Professional electronics manufacturing
Package Includes:

1x XG50 Solder Paste (50g)